碱金属
溶解
聚酰亚胺
水溶液
高分子化学
材料科学
残留物(化学)
聚合物
羧酸
苯酚
化学
有机化学
复合材料
图层(电子)
作者
Takashi Ueno,Yoshiaki Okabe,T. Miwa,Yasunari Maekawa,Géraldine Rames‐Langlade
出处
期刊:Acs Symposium Series
日期:1998-09-01
卷期号:: 358-367
被引量:7
标识
DOI:10.1021/bk-1998-0706.ch027
摘要
We report on the positive alkali-developable photosensitive polyimides based on an alkali-soluble polyimide precursor as a base polymer and diazonaphthoquinone (DNQ) sensitizer to improve process stability and sensitivity. Polyamic acid ester with pendant carboxylic acid (PAE-COOH) showed good dissolution behavior in aqueous alkali developer. The dissolution rate of PAE-COOH was controlled by the content of pendant carboxylic acid. It was found that a photosensitive system composed of butyl ester of PAE-COOH and a DNQ compound can avoid the residue at the edge of hole patterns (footing) after development, while that of methyl ester of PAE-COOH showed the residue. A DNQ compound containing sulfonamide derived from diaminodiphenylether renders improved sensitivity compared with DNQ compounds derived from phenol derivatives.
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