Development of flip chip package technology

Flip chip technology is widely applied in the integrated circuit package. The development of flip chip technology(FC) is introduced, and key technologies, including UBM, solder bump, underfill, substrate, are also discussed. Several new techniques such as the Cu pillar technology and C4NP are stated. Besides, the reliability of flip chip is expounded. On top of these, the combining with the trend of FC and TSV(through-silicon-via) technology is expected in the end.