Technique Characteristic Discussion of Lead-freeWave Soldering Technology and Equipment
作者
Hu Qiang
摘要
Introduce technology characteristic of lead-free wave soldering,and introduce each subsystem of lead-free wave soldering equipment according as technology process. Compare lead-free soldering to Sn-Pb soldering from solder wettability,solder oxidation and intermetallic component formation.Put forward attentive problems of lead-free soldering process and how to solve these.From technology of lead-free soldering, wave soldering process is a uniform system.Change of each parameter maybe affects solder joints performances.We should optimize wave soldering parameters for excellent solder joints.