锡膏
焊接
焊接性
铅(地质)
材料科学
可靠性(半导体)
环境友好型
可焊性
冶金
焊接
功率(物理)
地质学
物理
地貌学
生物
量子力学
生态学
作者
Zhi Wei Wang,Xuan Li,Hong Chen
出处
期刊:Key Engineering Materials
[Trans Tech Publications]
日期:2018-11-01
卷期号:789: 216-220
被引量:2
标识
DOI:10.4028/www.scientific.net/kem.789.216
摘要
The components of the flux are optimized and the environmental friendly flux withexcellent comprehensive performance is prepared. Then the composition of the solder paste isoptimized to prepare the SMT environmental protection and high efficient lead-free solder paste, andits performance is studied. The results show that the storage stability, printability, weldability andenvironmental protection of the SMT environmental protection and high efficient lead-free solderpaste are good, and the reliability is high. The related technical indexes have reached or superior tothe commercial solder paste, and have reached the commercial level initially.
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