Using phase-corrected Bessel beams to cut glass substrates with a chamfered edge

Ultrafast laser cutting of a glass substrate at an oblique angle is demonstrated using a phase-corrected Bessel beam. Simulations are used to predetermine the ideal phase of the incident Bessel beam such that an unaberrated Bessel beam is formed inside the tilted substrate. Additional corrections to the beam such as shortening, moving the intensity of the beam within the substrate, and the formation of an elliptical focal spot were necessary to ensure consistent chamfering of the substrate and are discussed herein. Three cuts are combined to create a damage tract in the glass substrate in the shape of a chamfer, and then the glass is separated using a C O 2 laser resulting in a chamfered edge.