Simulation and experimental investigation of contact spot temperature for electrical contact components

Abstract The contact spot temperature of electrical contact components substantially affects the reliability and electrical life of any electrical connections within the electrical engineering. In this paper, finite element model of typical spring structure components is built by using COMSOL Multiphysics software. Furthermore, the transient process of contact temperature is simulated by taking account of film resistance on the contact surface. Moreover, a test rig is introduced that makes it possible to measure the electrical contact resistance and temperature within the electrical contact components simultaneously. Finally, correlation between contact resistance and contact spot temperature with different contact force and current levels are investigated explicitly.