A study of vapor-phase deposition of silicon nitride layers by ammonolysis of dichlorosilane at lowered pressure

Deposition kinetics of silicon nitride layers at lowered reactor pressures of 10–130 Pa and temperatures in the range 973–1073 K has been studied. The equilibrium constant of the bimolecular reaction of dichlorosilane with ammonia has been calculated. The apparent activation energies calculated taking into account the experimental growth rate nearly coincide with the experimental data. Recommendations for improving the quality of silicon nitride layers are made.