肖特基势垒
材料科学
肖特基二极管
透射电子显微镜
合金
扫描透射电子显微镜
硅
凝聚态物理
电阻率和电导率
分析化学(期刊)
光电子学
纳米技术
冶金
二极管
化学
电气工程
物理
工程类
色谱法
作者
Jack Chan,M. Balakchiev,Andrew M. Thron,R. A. Chapman,Deborah J. Riley,S. C. Song,A. Jain,James W. Blatchford,J. B. Shaw,Klaus van Benthem,Eric M. Vogel,Christopher L. Hinkle
摘要
Temperature dependent current-voltage measurements show that the addition of only 10% Pt to NiSi causes an increase of Schottky barrier height (SBH) from 0.65 eV for NiSi to 0.78 eV for the 10% Pt alloy. Internal photoemission measurements resolve two SBHs in all alloyed samples with ≥5% Pt incorporation corresponding to NiSi and PtSi (∼0.68 eV and ∼0.80 eV), proving that each contributes independently to junction current. High angle annular dark field imaging with scanning transmission electron microscopy confirms Pt segregation to the Ni(Pt)Si/Si interface. The resulting increased SBH may therefore be detrimental to contact resistivity in future technology nodes.
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