Ferroelectric MXene-assisted BiFeO3 based free-standing memristors for multifunctional non-volatile memory storage

MXenes公司 材料科学 记忆电阻器 超级电容器 铁电性 电阻随机存取存储器 铋铁氧体 光电子学 纳米技术 非易失性存储器 储能 电压 碳化钛 电极 电化学 电气工程 复合材料 碳化物 电介质 化学 工程类 功率(物理) 物理 物理化学 多铁性 量子力学
作者
Kubra Sattar,Rabia Tahir,Houbing Huang,Deji Akinwande,Syed Rizwan
出处
期刊:Carbon [Elsevier BV]
卷期号:221: 118931-118931 被引量:3
标识
DOI:10.1016/j.carbon.2024.118931
摘要

Extensive research focuses on 2D MXenes ascribed to their adaptable behavior under external parameters, intrinsic ferroelectric nature through oxidation and their tailored conductive ability, resulting in exceptional electrochemical and flexible data storage applications. By virtue of these tunable capabilities, titanium carbide Ti3C2Tx MXene (M) has been incorporated as electrodes in free-standing novel memory devices comprising of Bismuth Ferrite (BFO), Graphene Oxide (GO) and heated Ti3C2Tx MXene (h-M) as active functional layers. These devices, owing to their distinct conduction mechanisms, transform the capacitive like resistive switching in M/BFO/M scheme to pure memristor switching with the addition of GO in M/BFO/GO/M, exhibiting potential ON/OFF ratio along with increased endurance of > 102, the factor crucial for practical implementations. Here also, the assistance of heated Ti3C2Tx MXene as an additional active layer with BFO has marked the co-existence of negative differential resistance (NDR) along with resistance switching (RS) as a novel report, observed for the first time in M/BFO/h-M/M. The reproducibility of NDR and RS under 103 sweeps and three memory architectures with an ON/OFF resistance ratio of 102 have made them emerge as a potential ensemble for multi-level storage and multifunctional characteristics. This work fits the noticeable increase in ON/OFF ratio of M/BFO/h-M/M out of the three explored memristor devices and its current-voltage feature mimicking the charge-discharge response in energy storage domain will pave the way for next generation, non-volatile energy-efficient computing architectures as it holds immense importance for enhancing the density of integrated flexible electronics.

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