堆栈(抽象数据类型)
石墨烯
材料科学
抗坏血酸
色散(光学)
热的
功率(物理)
光电子学
纳米技术
凝聚态物理
复合材料
光学
化学
物理
热力学
计算机科学
程序设计语言
食品科学
作者
Zuo Pan,Yanhong Wu,Hong Yuan,Runli Tang,Lei Ji,Bucun Zhou,Chuanren Ye,Dawei Zhang,Yan Qu,Hengxing Ji,Yanwu Zhu
出处
期刊:Carbon
[Elsevier BV]
日期:2021-06-30
卷期号:182: 799-805
被引量:31
标识
DOI:10.1016/j.carbon.2021.06.058
摘要
The thermal dispersion power depends on thermal conductivity and thickness of the thermal dispersion material that is a critical component of modern electronic devices due to the demands of high operating power in a miniaturized space. Films made of assembled graphene flakes have been becoming an emerging thermal dispersion material owing to their high thermal conductivity and tunable thickness up to millimeters, which outperform that of artificial graphite films made from polyimide. But the thermal conductivity typically decreases with the increase of film thickness. In our work, by pre-reducing the graphene oxide with Vitamin C and sequentially annealing the stacking films at 2950 °C, a 80 μm-thick graphene film (GF) with an in-plane thermal conductivity of above 1600 W/(m·K) is achieved. Detailed characterizations indicate that, the addition of Vitamin C is beneficial to the assembly ordering of graphene oxide platelets and the defect healing during the thermal annealing, which both contribute to the excellent thermal conductivity of the films. Our work provides an industrially scalable strategy towards high performance heat dissipation films for future electronic devices.
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