CONTROLLING AND OPTIMIZATION OF THERMAL PROFILE IN REFLOW SOLDERING

Heating factor, Q is a quantitative parameter describing a process of reflow soldering. It can be used to evaluate a reflow soldering process and the reliability of solder joints. The value of Q is directly related to the energy absorbed by solder joint during heating and the morphology of Intermetallic Compound formed at the interface between solder and pad. Electronic product manufacturers use heating factor as a technical evaluation parameter to guide the adjustment of reflow soldering process and the optimization of reflow soldering curve, to ensure the best reliability of the circuit board. Solder paste manufacturers use heating factor to represent characteristics of their reflow soldering products, and to customize products according to consumer's requests. Equipment manufacturers for reflow soldering use heating factor as an important controlling parameter to establish automatic system for managing solder joint reliability. A reliable soldering result can be achieved using the automatic reflow management system, to control and optimize thermal profile, which leads to the adjustment of the heating factor.