Contact Mechanics and Lubrication Hydrodynamics of Chemical Mechanical Polishing

A preliminary model for the contact mechanics and fluid mechanics of the chemical mechanical polishing process is presented. Only the basic equations of elastic contact surface mechanics and hydrodynamic lubrication are required. Although the model is highly idealized, no ad hoc assumptions or adjustable parameters are required. Some new experimental results are presented, reinforcing the counterintuitive experimental determination of suction fluid pressure below the pad. The model correctly predicts the magnitude of the suction pressure and the effect of load, speed, and roughness. © 1999 The Electrochemical Society. All rights reserved.