Semiconductor Joining by the Solid-Liquid-Interdiffusion (SLID) Process

The acronym SLID is used to describe a process whereby high‐temperature phases are formed by diffusion in the presence of liquid. A technique is discussed which utilizes these phenomena in producing high‐temperature‐stable bonds which have been fabricated at low temperatures. The binary systems Ag‐In, Au‐In, Cu‐In among others exhibit these characteristics. Photomicrographs and electron probe microanalysis data are presented to identify and describe the phases formed in these bonds. Some applications for the use of this joining technique are suggested in addition to the feasibility of extending this method to the use of ternary and higher order alloy SLID systems.