Sintering Behavior and Properties of Mo‐Cu Composites

A simple microwave‐assisted aqueous solution strategy combined with a subsequent low‐temperature hydrogen reduction process was used to prepare Mo‐Cu nanopowders. In order to systematically investigate the densification behavior and properties of Mo‐Cu composites, the densification, microstructure, hardness, electrical conductivity, thermal conductivity, and bending strength of Mo‐Cu compacts were tested after sintering at different temperatures. Results show that the sintering temperature is a critical factor in the densification process of Mo‐Cu composites. The shrinkage rate, density, and hardness of sintered composites increase as the temperature rises. However, too high sintering temperature resulted in the decrease in electrical conductivity (EC), thermal conductivity (TC), and bending strength. By optimizing all the performance indicators, high‐performance Mo‐25 wt.% Cu composites with a homogeneous microstructure accompanied with good physical and mechanical properties could be successfully obtained by sintering for 2 h at 1200°C.