材料科学
电介质
电容器
聚合物
复合材料
聚酰亚胺
复合数
耐久性
单体
智能聚合物
储能
碳化硅
超级电容器
热导率
陶瓷
电导率
限制
酰亚胺
高-κ电介质
使用寿命
先进复合材料
电阻率和电导率
热的
作者
Mingyuan Yang,Hongyu Jiang,Ying Xu,Birong Zeng,Chaohua Peng,Conghui Yuan,Lizong Dai
标识
DOI:10.1002/adfm.202532072
摘要
ABSTRACT The extensively developed high‐temperature energy storage (HTES) encounters rising sustainable issues caused by polymer dielectrics. Due to the harsh service conditions, including high temperature and voltage, daunting challenges remain in the design of polymer dielectrics that can break through the trade‐offs among recyclability, heat‐resistance, thermal‐conductivity, and electrical performances, which are pivotal for HTES. Herein, a polymer dielectric architecture is introduced that integrates an imine‐linked fluorinated polyimide (IM‐FPI) network with covalent triazine‐based nanosheets (CNNSs). Dynamic imine bonding between the fluorinated imide segments and CNNS fillers enables composite films that simultaneously address the conventional trade‐offs limiting polymer dielectrics. The thermal conductivity of the composite films reaches 3.95 W m −1 K −1 , while capacitors enabled by CNNS/IM‐FPIs show exceptional energy density ( U d = 4.98 J cm −3 at 200°C, η = 90%) and durability ( η > 90% after 1 × 10 5 charging‐discharging cycles at 200°C). CNNS/IM‐FPIs can be fully decomposed into monomers and fillers for closed‐loop recycling, and the recovered CNNS/IM‐FPIs can maintain the intrinsic performances. This study provides a promising approach to eco‐friendly high‐temperature polymer dielectrics.
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