The Effects of Size and Array of N-GaN Contacts on Operation Voltage of Padless Vertical Light Emitting Diode

发光二极管 当前拥挤 材料科学 光电子学 电压 二极管 炸薯条 消散 电极 电气工程 电流(流体) 工程类 物理 量子力学 热力学
作者
Hokyun Rho,Jun-Seok Ha
出处
期刊:Journal of the Microelectronics and Packaging Society 卷期号:21 (1): 19-23
标识
DOI:10.6117/kmeps.2014.21.1.019
摘要

LED (Light Emitting Diode) 시장의 발전이 빠르게 이루어지고 있음에 따라 점차 고효율 LED의 필요성이 증가하고 있다. 이에 우리는 Hole Type의 Padless 신 구조 수직형 LED에서, 접촉 전극의 크기와 그 배치가 Chip의 가동 전압에 어떠한 영향을 미치는지 알아보았다. 이를 위하여 LED simulation을 통한 계산과 실제 Chip 제작을 통한 전기적 특성 평가를 하였다. 그 결과, Simulation 을 통하여 n전극의 크기가 커질수록 구동전압이 낮아짐을 확인하였고, N 전극의 형태가 확산됨에 따라서도 구동전압이 낮아짐을 확인하였다. 이러한 추세는 실제 제작한 LED Chip의 측정 결과와 비슷한 경향을 나타내었다. For the application of light-emitting diodes (LEDs) for general illumination, the development of high power LEDs chips became more essential. For these reasons, recently, modified vertical LEDs have been developed to meet various requirements such as better heat dissipation, higher light extraction and less cost of production. In this research, we investigate the effect of Size and Array of N-GaN contact on operation voltage with new structured padless vertical LED. We changed the size and array of N-electrodes and investigated how they affect the operation voltage of LEDs. We simulated the current crowding and expected operation voltage for different N-contact structures with commercial LED simulator. Also, we fabricated the padless vertical LED chips and measured the electrical property. From the simulation, we could know that the larger size and denser array of n-electrodes could make operation voltage decrease. These results are well in accordance with those measured values of real padless vertical LED chips.
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