Synthesis and Properties Study of Low Dielectric UV Curable Epoxy Resin/Fluorocarbon Composites

The development and application of low-dielectric solder resist for FCBGA is a critical research area in electronic packaging. With the advancement of high-frequency communication technology, there are increasing demands for solder resist (SR) used as coating materials to have low dielectric constant, low dielectric loss, and high thermal resistance. In this study, a photosensitive and alkali-soluble resin was synthesized by reacting acrylic acid with epoxy resin to introduce photosensitive double bond groups, followed by a reaction with anhydride to generate carboxyl groups. Fluorocarbon fillers were incorporated into the system to further reduce the dielectric constant and dielectric loss of SR films. This paper discussed the effects of different fluorocarbon contents on the dielectric, thermal, photolithography, and mechanical properties of SR films in detail, and showed great great industrial application prospects.