Innovative configurations for heat sink integrated with piezoelectric fans

Piezoelectric (PE) fans are gradually replacing conventional axial flow fans in the field of heat dissipation for microelectronics due to small size and high efficiency. However, the flow characteristic of PE fans was seldom considered when arranging heat sink fins, which could not utilize the fans' advantages. Here, the design of fin arrangement based on the transient flow field generated by the vibration of dual PE fans in the channel was calculated and analyzed by CFD simulation and dynamic grid technology. Four zones with different flow field characteristics were found: Zones 1 and 4 which located inlet and outlet of the channel were Parallel flow zone. Zone 2 with vortices corresponds to the area ranges from the waist of blades to middle section of the channel was Multiple vortices flow zone. Zone 3 with high-speed vortices and jet flows corresponds to the area ranges from middle section of the channel to halfway downstream of blades region was Diffuse flow zone. Innovative configurations of heat sinks where fins arranged at the inlet and surrounding blades were designed according to the flow field characteristics: the loss of high-speed airflow to the inlet was prevented effectively and heat dissipation in the downstream heat sinks was dispersed by fins arranging in Parallel flow zone and Multiple vortices flow zone. The development and merging of high-speed vortices were strengthened by the inhomogeneous pin-fins arranging in Diffuse flow zone. The optimal coordination between the velocity field and the temperature gradient field among innovative configurations was found based on the field coordination analysis. Heat transfer performance was enhanced by new designs where the average temperature compared to conventional heat sink with PE fans was reduced by 16.7°. Our work provided a new fins arrangement to achieve uniform temperature distribution and high heat transfer performance for heat sink integrated with PE fans and would benefit the application in thermal management of high power devices integrated with PE fans.