Development of Chemical Mechanical Polishing Slurry

Chemical mechanical polishing(CMP) is the only technique known to provide global planarization of sub-micron devices.Development of CMP slurry,variety,chemical composing and polishing mechanism are reviewed.Accompanied with enlarging size of silicon wafer,increasing in integration level and decreasing in line width,it should be strengthened on the study of CMP slurry and CMP mechanism.