石墨烯
热撒布器
材料科学
热导率
透明度(行为)
光电子学
电子设备和系统的热管理
石墨烯纳米带
热的
数码产品
图层(电子)
散热片
复合材料
纳米技术
机械工程
计算机科学
电气工程
热力学
工程类
物理
计算机安全
作者
Sang-Hoon Bae,Roxana Shabani,Jae-Bok Lee,Seung‐Jae Baeck,Hyoung J. Cho,Jong‐Hyun Ahn
标识
DOI:10.1109/ted.2014.2364606
摘要
Graphene known for its superb physical properties, such as high transparency and thermal conductivity, is proposed as a solution to the problem of thermal management of the electronic devices, requiring transparency and cooling. It is shown that graphene heat spreader layer drives the heat out of the device more efficiently as compared with the commercially used metal thin films for integrated circuit cooling. An application of graphene heat spreader is proposed and tested in chip-on-film packaging. Graphene performance is compared with a gold layer with a similar transparency experimentally and theoretically as a proof of the efficient thermal management capability of graphene.
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