材料科学
复合材料
涡流
涂层
磁导率
磷酸
铁氧体(磁铁)
粒度分布
复合数
粒径
铁氧体磁芯
饱和(图论)
润湿
图层(电子)
磁芯
相对渗透率
扫描电子显微镜
芯(光纤)
肿胀 的
粒度
磁滞
紧迫的
作者
Lanlan Guo,Xiaodong Jing,Hai Huang,Dongqing Zhou,Junwu Nie,Chenglong Yuan,Xiaoqiang Xiong,Junjie Yan,Tongyun Zhao,Huayang Gong,Selim Ceylan
标识
DOI:10.1021/acsaelm.5c02007
摘要
Soft magnetic composites (SMCs) have found extensive application in electrical energy conversion. Enhancing the high-frequency operational efficiency and reducing the core loss of the materials are critical for improving energy conversion efficiency and minimizing energy consumption. Here, we develop a methodology to enhance the effective permeability and its frequency stability under high-frequency operation and reduce core loss, through optimized particle size distribution and improved insulation layer morphology. A Ni–Zn ferrite-phosphate coating approach is proposed. Results indicate that optimizing the particle size distribution of FeNi45 to 53–75 μm leads to a 44.3% increase in effective permeability ( f = 50 kHz) and an 82.0% reduction in core loss ( f = 50 kHz, B m = 50 mT). As the serrated grain morphology and crack of the Ni–Zn ferrite layer proved insufficient for insulation, phosphoric acid with good wettability was subsequently applied over the ferrite layer, forming a continuous, complete, and dense Ni–Zn ferrite-phosphate composite insulation layer. Scanning electron microscopy analysis revealed that the phosphate effectively fills the gap and crack within the ferrite, blocking eddy current paths. With a 1 wt % phosphoric acid addition, yielding a core loss of 146.71 mW/cm 3, particularly the eddy current loss decreased significantly from 386.21 mW/cm 3 to 26.47 mW/cm 3 ( f = 50 kHz, B m = 50 mT). Concurrently, exhibited an effective permeability of 82.85 ( f = 50 kHz) and a DC bias performance of 53% ( f = 50 kHz, H DC = 7.96 × 10 3 A/m (1 Oe ≈ 79.6 A/m)). These findings provide insights and practical methodologies for optimizing coating strategies in SMCs, which is beneficial for enhancing their high-frequency working efficiency in electronic applications and reducing energy consumption.
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