有机硅
聚合物
电介质
化学
制作
纳米技术
化学工程
有机化学
复合材料
高分子科学
高分子化学
材料科学
光电子学
工程类
病理
替代医学
医学
作者
Jiaren Hou,Jing Sun,Qiang Fang
标识
DOI:10.1002/cjoc.202300125
摘要
Comprehensive Summary Low dielectric (low‐ k ) organosilicon polymers have received extensive interests from industry and academia due to good electrical insulation, high temperature resistance, flame retardancy and hydrophobicity. These attractive properties enable them to be utilized as low‐ k materials in fabrication of electronic devices in high‐frequency communication technology. This review summarizes recent progress in developing low‐ k organosilicon polymers, including the synthetic methods and properties of different organosilicon polymers classified according to the chemical structures. It may provide some inspiration to design new low‐ k organosilicon polymers for application in the future.
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