材料科学
涂层
表面粗糙度
扫描电子显微镜
电火花加工
机械加工
等离子体
复合材料
参数统计
冶金
物理
数学
统计
量子力学
作者
R. Rajeshshyam,D. Muniraj,V.M. Sreehari
出处
期刊:Physica Scripta
[IOP Publishing]
日期:2024-01-03
卷期号:99 (2): 025607-025607
标识
DOI:10.1088/1402-4896/ad1a3a
摘要
Abstract Electrical discharge drilling is a non-conventional machining process that is effective and economical for cutting difficult-to-cut conductive materials. In this work, the parametric assessment of functionally graded Al/Al 2 O 3 coating sprayed by plasma on Al6061-T6 faceplates is investigated. Initially, four different graded layers of Al/Al 2 O 3 (50:50, 40:60, 30:70, and 20:80) were processed through plasma spray and deposited coating morphology, splat formation, and cross-sectional structure were confirmed through a scanning electron microscope. The parametric assessment has been investigated based on the effect of electrical discharge drilling parameters peak current (P c ), pulse-on time (P on ), and gap voltage (V g ) on the material removal rate (MRR), tool wear rate (TWR), machining time (MT), surface roughness (SR), taper angle (TA), and overcut (OC). The selected process parameters were P c from 8 to 14 A, P on from 60 to 90 μ s, and V g from 20 to 80 V respectively. The parametric assessment was performed based on the objectives of maximizing the MRR and minimizing the TWR, MT, SR, TA, and OC. The effect of process parameters on various output responses was summarized. From the experimentation, MRR is significantly affected by V g , and maximum MRR is found at the high levels of P c and P on. Reduced TWR was observed at the 2nd level of P c (0.058 mm 3 min −1 ) and 4th level of V g (0.076 mm 3 min −1 ) and this same factor has more influence on MT. High level of P c and P on exhibits maximum TWR with erosion. The results show that P on time relatively gives low SR (2.36 μ m) and minimum OC (0.0015 mm) was achieved at a high level of V g . Few un-drilled holes with cracks were witnessed due to high TWR. Many drilled holes exhibit < 2° of TA which indicates good dimensional accuracy.
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