Experimental and numerical investigation on thermal characteristics of the heat sink integrating 3D vapor chamber heat spreader and liquid cooling fins

The traditional vapor chamber/ heat pipe heat sink in high-power chip heat dissipation structures consists of two separate parts. The contact thermal resistance between these parts leads to an increase in thermal resistance during the heat transfer process. To mitigate the contact thermal resistance and improve the heat dissipation performance of vapor chamber heat sinks, this paper proposes a heat sink integrating a 3D vapor chamber heat spreader and liquid cooling fins. Experiments and simulations were carried out to analyze the heat transfer characteristics under different heating powers. The pressure drop and thermal resistance were calculated to analyze the internal phase-change heat transfer process and capillary heat transfer limit. The simulation results were in close agreement with the experimental data for heating powers ranging from 397 to 795 W, with the thermal resistance of the proposed heat sink of about 0.04℃/W. Compared to three traditional vapor chamber heat sinks operating under the same heat flux, the proposed type exhibited a noteworthy enhancement in the heat transfer performance, leading to a reduction in thermal resistance by approximately 44% to 67%.