材料科学
合金
微观结构
电子背散射衍射
冶金
成核
纹理(宇宙学)
扫描电子显微镜
降水
动态再结晶
透射电子显微镜
再结晶(地质)
钛合金
复合材料
热加工
热力学
纳米技术
古生物学
物理
人工智能
生物
气象学
计算机科学
图像(数学)
作者
Qiming Xue,Baohong Tian,Ting Yin,Yi Zhang,Junchao An,Yong Liu,Zhiyang Zhang,Ke Jing
标识
DOI:10.1016/j.jmrt.2023.08.282
摘要
The hot deformation behavior of Cu–Sn–Ti–(Cr) alloys was studied using Gleeble-1500D thermo-mechanical simulator ranging from 550 to 950 °C, and the strain rate was 0.001–10 s−1. The microstructure evolution of the alloy was analyzed using characterization methods such as electron backscatter diffraction (EBSD), scanning electron microscope (SEM) and transmission electron microscope (TEM). Cu–Sn–Ti–(Cr) alloys were calculated by establishing the constitutive equation of the alloy. The activation energies of Cu–Sn–Ti and Cu–Sn–Ti–Cr alloys are 275.884 and 283.550 kJ/mol, respectively. The results indicate that the addition of Cr element has an inhibitory effect on the nucleation and improve refinement of dynamic recrystallization (DRX) in Cu–Sn–Ti alloy. The texture of Cu–Sn–Ti alloy is Cu texture at 750 °C and the texture contained in Cu–Sn–Ti alloy is Goss texture, Cubic texture and Cu texture when the temperature is raised to 950 °C. The texture of Cu–Sn–Ti–Cr alloy at 750 °C is Goss texture. The Goss texture transforms into Cubic texture and Cu texture when the temperature is raised to 950 °C. The precipitates present in Cu–Sn–Ti alloy include CuSn3Ti5 phase and Cu4Ti phase. The addition of Cr element adds a new phase of Cr to the alloy and also makes the distribution of precipitates more uniform and increases in quantity.
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