Diamond Composites with TiC, SiC and Ti 3 SiC 2 Bonding Phase

The problems connected with producing diamond composites with 30 wt.% of bonding phase in form of: SiC, TiC, and Ti 3 SiC 2 are presented in the paper. Increasing the fraction of the bonding phase within the composite generally helps to reduce internal stresses. Composites were sintered at pressure 8.0 - 0.2 GPa and temperature of 2070 - 50 K using the Bridgman type high pressure apparatus. Interactions in the diamond-SiC, the diamond-TiC, and the diamond-Ti 3 SiC 2 systems were studied by means of transmission electron microscope (TEM) and X-ray diffraction. Density was measured pycnometrically. The wear resistance studies of these composites were carried out using pin - on disc type laboratory equipment. Hardness was measured with Vickers apparatus. Results of measurements of physical and mechanical properties are reported.