环氧树脂
材料科学
复合材料
耐热性
空间电荷
电阻和电导
电阻率和电导率
热导率
电气工程
物理
量子力学
工程类
电子
作者
Qingguo Chi,Xiaowen Zhang,Changhai Zhang,Yu Feng,Chao Tang,Zhonghua Li,Tiandong Zhang
标识
DOI:10.1007/s10854-022-08650-7
摘要
The ever-increasing development of power modules requires epoxy (EP) encapsulants to have excellent heat-resistance capability. Many studies have been conducted on improving the heat-resistance of epoxy encapsulants and have made important achievements in recent years. However, the electrical insulation of the EP-based high heat-resistance materials has not been paid enough attention and less studied. In this paper, BMI/EP systems have been prepared, and the electrical characteristics and heat-resistance of the modified BMI/EP have been investigated. Dynamic thermomechanical analysis shows the introduction of BMI greatly improves the heat-resistance of the epoxy systems. The electrical conductivity and breakdown characteristics of BMI/EP samples were measured at 30, 50, and 70 °C, respectively. The analysis of space charge indicates the trap distribution in the 10%BMI can significantly suppress carrier migration, resulting in the highest electric breakdown strength and the lowest current density. The excellent insulation properties with improved heat-resistance demonstrate that BMI/EP has great potential to be used in power modules.
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