A novel ultrasonic consolidation method for rapid preparation of diamond/Cu composites

In this study, diamond/Cu composites were fabricated using ultrasonic consolidation and resistance rapid diffusion technology with Cr addition to improve the wettability between diamond and Cu martix, the interfacial configuration and thermal conductivity of diamond/Cu composites were also investigated. Excellent interfacial bonding between diamond and Cu matrix was achieved by surface metallization of diamond with Cr, and the formation of subgrain boundaries was observed in the Cr7C3 and Cu matrix grains near the interface. The thermal conductivity of the composite prepared by this process reaches 421.314 W/m·K when diamond added mass at 1.34%, which is 12% higher than that of the Cu matrix.