中间层
光子学
材料科学
硅光子学
光电子学
硅
光纤
基质(水族馆)
倒装芯片
块(置换群论)
纤维
光子集成电路
电子工程
计算机科学
纳米技术
工程类
电信
图层(电子)
复合材料
地质学
几何学
蚀刻(微加工)
胶粘剂
数学
海洋学
作者
Lim Soon Thor,Li Yu,Jong Ming Chinq,Eva Wai Leong Ching,Thomas Y. L. Ang,Ong Jun Rong,Phua Wee Kee,G. Alagappan,Png Ching Eng,Lim Teck Guan
标识
DOI:10.1364/acpc.2020.t3g.1
摘要
A Silicon Optical Interposer for 2.5D integration of high speed electrical and optical circuit is proposed here. The Si Interposer functions as a Base Substrate for optical alignment of the Photonic IC and the fibers which are held in a Si Fiber Block or integrate directly. The alignment is semi passive, it utilizes a set of U-grooves with submicron accuracy and Dummy Fiber’s cylindrical face for self-alignment. The Photonic IC and the Fiber Block are faced down assembled on the Si Interposer. Electrical connections are made using flip chip micro bumps between the Photonic IC and the Si Interposer.
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