LDMOS
可靠性(半导体)
绝缘体上的硅
击穿电压
材料科学
电气工程
MOSFET
光电子学
电压
电子工程
硅
工程类
晶体管
功率(物理)
物理
量子力学
作者
Harsha B. Variar,Jhnanesh Somayaji,Mayank Shrivastava
标识
DOI:10.1109/icee56203.2022.10117871
摘要
This work presents the performance and re-liability (HCI, SOA and ESD) co-design insights of Ul-tra High Voltage (UHV) Laterally Diffused Metal Oxide Semiconductor (LDMOS) devices. Device design insights and performance optimization guidelines for four different types of UHV LDMOS devices (Conventional, RESURF, SOI and RESURF SOI) is systematically developed using 3D TCAD. For the first time, a step-by-step approach to design gate, drain and source field plates and its implications on the co-design of these four different UHV designs is investigated, which demonstrated significant improvement in the device breakdown without altering its ON-resistance. Finally, performance and HCI, ESD & SOA reliability benchmarking is done for the optimum designs of all four (i.e. Conventional, RESURF, SOI and RESURF SOI) UHV LDMOS architectures.
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