Performance Analysis of Single-Phase Immersion Cooling in high powered electronic components

In response to the challenges posed by increasing energy density in modern data centers, single-phase immersion cooling (SPIC) offers an efficient solution that enhances thermal performance by enabling dielectric fluids to directly contact all powered components. This research investigates the performance of SPIC when combined with forced or targeted cooling techniques, where coolant is directed towards the heat sinks for optimal heat dissipation. Four distinct heat sink / cold plates designs were evaluated: two immersion optimized skived fin design, one impinging targeted flow immersion optimized cold plate design, and non-immersion optimized cold plate design. To facilitate this evaluation, a custom tank and cooling loop with temperature, pressure and flow measurements were constructed to analyze the thermal and hydraulic performance of the heat sinks. The dielectric fluid used for this experiment was polyalphaolefin 2, chosen for its excellent thermal properties and dielectric strength. A thermal test vehicle featuring a ceramic heater with embedded thermocouples was built to monitor surface temperature changes. The experimental setup allowed for variations in supply coolant flow rates from 3 to 7 liters per minute, with inlet temperatures ranging from $17^{\circ} \mathrm{C}$ to $45^{\circ} \mathrm{C}$, while maintaining a constant heater surface temperature of $80^{\circ} \mathrm{C}$. The study aimed to evaluate both thermal and hydraulic performance, focusing on metrics such as temperature distribution, thermal resistance, and pumping power. This investigation provides insights into the capabilities of single-phase immersion cooling, paving the way for more effective thermal management strategies in future data center designs.