材料科学
数码产品
可穿戴技术
纳米技术
电子材料
柔性电子器件
薄脆饼
可伸缩电子设备
弯曲
光学(聚焦)
可穿戴计算机
电子线路
机械工程
工程物理
计算机科学
电气工程
复合材料
工程类
光学
物理
嵌入式系统
作者
Dae‐Hyeong Kim,John A. Rogers
标识
DOI:10.1002/adma.200801788
摘要
Abstract New electronic materials have the potential to enable wearable computers, personal health monitors, wall‐scale displays and other systems that are not easily achieved with established wafer based technologies. A traditional focus of this field is on the development of materials for circuits that can be formed on bendable substrates, such as sheets of plastic or steel foil. More recent efforts seek to achieve similar systems on fully elastic substrates for electronics that can be stretched, compressed, twisted and deformed in ways that are much more extreme than simple bending. This article highlights some recent progress in this area, with an emphasis on materials approaches and demonstrated devices.
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