A new laser micromachining technique using a mixed-mode ablation approach

This paper presents a novel laser micromachining technique using a mixed-mode ablation approach. Some important techniques, which include laser drilling, laser ablation, and laser cutting, have been developed to overcome common problems in laser micromachining, such as material recast, big heat affected zone (HAZ) problem, and laser polarization effect. Ablation parameters for various microstructures on single crystalline silicon have been optimized to demonstrate through-holes, post microstructures, and gear structures. The developed laser micromachining technique has minimized common problems in laser micromachining - HAZ, recast, microcracks to the sidewall of structures, and laser polarization effect.