邻苯二甲腈
材料科学
热稳定性
玻璃化转变
电介质
固化(化学)
复合材料
热分解
热固性聚合物
酞菁
介电损耗
聚合物
高分子化学
化学工程
有机化学
光电子学
纳米技术
工程类
化学
作者
Minjie Wu,Yuxuan Gu,Diyi Hao,Xinggang Chen,Xiaoyan Yu,Qingxin Zhang
标识
DOI:10.1002/mame.202100651
摘要
Abstract Phthalonitrile (PN) resin promising material for preparing high‐speed and high‐frequency electronic packaging because of its unique hightemperature resistance and excellent insulation performance. A fluorinated PN oligomer (4,4’‐bis ( p ‐perfluoro‐phenol‐(bis( p ‐phenol)perflouoropropane‐2,2‐diyl)‐ p ‐oxy‐diphthalonitrile) (PFDP)) containing trifluoromethyl and decafluorobiphenyl groups are designed, synthesized, and characterized. The oligomer is blended with 4‐(aminophenoxy) phthalonitrile (APPH), and then cured into polymers under the temperature‐programmed process. The reactive blend has good processability, and structures of isoindole, triazine ring, and phthalocyanine ring are found in the curing reactions. The fluorinated PN (P‐380) shows outstanding thermal stability and mechanical properties (5% thermal degradation temperature: 518 °C (N 2 ); 516 (Air), T Heat‐resistance index : 268 °C, activation energy of thermal decomposition: 334.89 kJ mol −1 , glass transition temperature ( T g) > 400 °C). Meanwhile, the fluorinated PN simultaneously exhibited a superior low dielectric constant ( D k , 2.21) and dielectric loss ( D f , 0.01) at 10 GHz. Moreover, the water absorption of the resin is as low as 0.74%, which meets the requirement of dielectric materials. These results would strongly suggest such PFDP PN resin as excellent packaging materials in those high‐tech applications such as aerospace and communication electronic devices.
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