材料科学
金属有机气相外延
化学气相沉积
电容器
光电子学
电介质
氮化物
击穿电压
图层(电子)
绝缘体(电)
铝
氮化铝
碳化硅
电压
复合材料
外延
电气工程
工程类
作者
Rabia Yasmin Khosa,J.T. Chen,Kjartan Pálsson,Robin Karhu,Jawad Ul‐Hassan,Niklas Rorsman,E.Ö. Sveinbjörnsson
标识
DOI:10.4028/www.scientific.net/msf.963.460
摘要
We report on a very low density of interface traps at the AlN/4H-SiC interface estimated from capacitance-voltage (CV) analysis of metal-insulator-semiconductor (MIS) capacitors. Single crystalline aluminum nitride (AlN) films are grown by metal organic chemical vapor deposition (MOCVD). Current-voltage (IV) analysis shows that the breakdown electric field across the AlN dielectric is 3 MV/cm. By depositing an additional SiO2 layer on top of the AlN layer it is possible to increase the breakdown voltage of the MIS capacitors significantly without having pronounced impact on the quality of the AlN/SiC interface.
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