Lv11
38 积分 2023-09-24 加入
Resist coating and developing process technology toward EUV manufacturing sub-7nm node
21天前
已完结
Cross-platform (NXE-NXT) machine-to-machine overlay matching supporting next node chip manufacturing
24天前
已完结
Combined overlay, focus and CD metrology for leading edge lithography
27天前
已完结
EUV resist modeling (PROLITH) for defect printability and stochastic behavior evaluation of 1Xnm DRAM technology node production
5个月前
已完结
A semi-empirical approach for predicting LER statistical distribution in advanced nodes
6个月前
已完结
Innovative wafer defect inspection mode: self-adaptive pattern to pattern inspection
7个月前
已完结
A yield prediction model and cost of ownership for productivity enhancement beyond imec 5nm technology node
8个月前
已完结
Enhanced EUV photolithography control for overcoming defectivity challenges
8个月前
已完结
Standard wafer with programed defects to evaluate the pattern inspection tools for 300-mm wafer fabrication for 7-nm node and beyond
8个月前
已完结
High-NA EUV defectivity inspection: overview and challenges
8个月前
已完结
Future prospects of computer-aided design (CAD) – A review from the perspective of artificial intelligence (AI), extended reality, and 3D printing
1年前
已采纳
An effective feature learning approach using genetic programming for crab age classification
1年前
已采纳
Synthesis and characterization of novel Cu3Bi3S7 nanoparticle by combustion using green fuel for photocatalytic degradation and electrochemical sensing applications
1年前
已采纳
A visual interaction consensus approach for fuzzy social network with trust propagation
1年前
已采纳
Parameter calibration method of clustered-particle logic concrete DEM model using BP neural network-particle swarm optimisation algorithm (BP-PSO) inversion method
1年前
已采纳
MCNN-DIC: A mechanical constraints-based digital image correlation by a neural network approach
1年前
已采纳
Hessian-based weighted guided image filtering
1年前
已采纳
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