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50 积分 2026-08-13 加入
Measurement and Modeling of Bond Wire Degradation in TO-Packaged SiC MOSFETs
6天前
已完结
Increasing package robustness with palladium coated copper wire
6天前
已完结
Increasing package robustness with palladium coated copper wire
6天前
已完结
Cu wire bond parameter optimization on various bond pad metallization and barrier layer material schemes
7天前
已完结
Behavior of aluminum oxide, intermetallics and voids in Cu-Al wire bonds
8天前
已完结
3mil Copper wire bonding capability study in 4um Al top metal by thermosonic bonding
8天前
已完结
Effect of copper over-pad metallization on reliability of aluminum wire bonds
8天前
已完结
Research Progress of Palladium-Plated Copper Bonding Wire in Microelectronic Packaging
12天前
已完结
Review of Topside Interconnections for Wide Bandgap Power Semiconductor Packaging
13天前
已完结
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