| 标题 |
Increasing package robustness with palladium coated copper wire |
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期刊:2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference 作者:Rodan A. Melanio; Regine B. Cervantes; Sonny E. Dipasupil 出版日期:2016-12-20 |
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(2025-6-4)