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20 积分 2025-08-27 加入
Extremely low thermal resistance in solid-state thermal pad from in situ graphite cracking for highpower artiffcial intelligence chip
3个月前
已完结
Extremely low thermal resistance in solid-state thermal pad from in situ graphite cracking for high-power artificial intelligence chip
3个月前
已完结
Direct Ink Writing of Polymer Composite Electrolytes with Enhanced Thermal Conductivities
5个月前
已完结
Spin-on deposition of amorphous zeolitic imidazolate framework films for lithography applications
6个月前
已完结
Thermal management materials for 3D-stacked integrated circuits
7个月前
已完结