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44 积分 2026-03-03 加入
The Role of Polycrystalline MoS2 as Diffusion Barrier in Ru Interconnects: Thermal Stability and Electrical Performances
5小时前
待确认
Revealing the Origins of Thermally Induced Anomaly in 18 nm Pitch Ruthenium Nanointerconnects on 300 mm Wafers
6天前
已完结
Revealing the Origins of Thermally Induced Anomaly in 18 nm Pitch Ruthenium Nanointerconnects on 300 mm Wafers
6天前
已关闭
Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper
8天前
已完结
Electromigration Reliability of Barrierless Ruthenium and Molybdenum for Sub-10 nm Interconnection
8天前
已完结
Area-Selective Atomic Layer Deposition of Ruthenium via Reduction of Interfacial Oxidation
11天前
已完结
Area Selective Deposition of Ru on W/SiO2 Nanopatterns via Sequential Reactant Dosing and Thermal Defect Correction
11天前
已完结
Area-Selective Deposition of Ruthenium Using Homometallic Precursor Inhibitor
11天前
已完结
Patterning challenges for direct metal etch of ruthenium and molybdenum at 32 nm metal pitch and below
15天前
已完结
Improved properties of atomic layer deposited ruthenium via postdeposition annealing
1个月前
已完结
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