Lv11
80 积分 2026-03-03 加入
Low-Temperature Ru–Ru Hybrid Bonding: Ar/H 2 Plasma and NH 4 OH Synergistic Activation for Ultrahigh Density Interconnection
1小时前
已完结
Electromigration Reliability of Barrierless Ruthenium and Molybdenum for Sub-10 nm Interconnection
1小时前
已完结
Atomic layer deposition
8天前
已关闭
Ultrathin Metal Films with Low Resistivity via Atomic Layer Deposition: Process Pressure Effect on Initial Growth Behavior of Ru Films
1个月前
已完结
Robust Overlay Control in 2-Level Semi-Damascene
1个月前
已完结
MP16/18 Integration in Ru Semi-Damascene using SiN-Based Core for Spacer-is-Dielectric SADP
1个月前
已完结
A novel integration scheme for self-aligend Ru topvia as post-Cu alternative metal interconnects
1个月前
已完结
Growth behavior and mechanism of atomic layer deposition of Ru for replacing Cu-interconnects
1个月前
已完结
Reliability Evaluation of Semi-damascene Ru/Air-Gap interconnect with Metal Pitch down to 18 nm
1个月前
已完结
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