Lv1
80 积分 2026-03-03 加入
Ultrathin Metal Films with Low Resistivity via Atomic Layer Deposition: Process Pressure Effect on Initial Growth Behavior of Ru Films
8天前
已完结
Robust Overlay Control in 2-Level Semi-Damascene
8天前
已完结
MP16/18 Integration in Ru Semi-Damascene using SiN-Based Core for Spacer-is-Dielectric SADP
8天前
已完结
A novel integration scheme for self-aligend Ru topvia as post-Cu alternative metal interconnects
8天前
已完结
Growth behavior and mechanism of atomic layer deposition of Ru for replacing Cu-interconnects
8天前
已完结
Reliability Evaluation of Semi-damascene Ru/Air-Gap interconnect with Metal Pitch down to 18 nm
9天前
已完结
皖公网安备34019202002308
