Lv1
62 积分 2023-07-26 加入
Thermally Shunted Heterogeneously Integrated DFB Laser Arrays Spanning O- and C-band Wavelengths
27天前
已完结
Novel all-around diamond integration with GaN HEMTs demonstrating highly efficient device cooling
1个月前
已完结
Enhanced cooling model for GaN HEMT based on thermoelectric cooler
1个月前
已完结
Thermoelectric Cooler-Driven Active Thermal Management for Enhanced Performance and Reliability of GaN Schottky Barrier Diode
1个月前
已完结
Integrated Thermal Management for a High-Power-Density Silicon Carbide Power Module With Die-Level Heat Flux Over 1000 W/cm²
1个月前
已完结
Active Thermal Management of GaN-on-SiC HEMT With Embedded Microfluidic Cooling
1个月前
已完结
Cooperative control of high aspect ratio anisotropic dry etching and composition for Bi2Te2.7Se0.3 thermoelectric film
2个月前
已完结
Electromagnetic Compatibility Study of TEC-Based Active Cooling Systems
2个月前
已完结
On-chip hotspot thermal delay and peak clipping using a heterogeneously integrated micro-thermoelectric cooler
3个月前
已完结
Thermal management of through-silicon vias and back-end-of-line layers in 3D ICs: A comprehensive review
3个月前
已完结
皖公网安备34019202002308
