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98 积分 2026-01-15 加入
Effect of plasma treatment on adhesion strength and moisture absorption characteristics between epoxy molding compound/silicon chip (EMC/chip) interface
2个月前
已完结
Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate
4个月前
已完结
Evaluation of five silane coupling agents on resin-titanium adhesion
5个月前
已完结
Copper-based tungsten coating by CVD: Microstructure, thermal shock resistance and interfacial bond force
5个月前
已完结
Universal Adhesion Promoters for Enhanced Adhesion on Metal and Polymeric Substrates
6个月前
已完结
Synthesis of adhesion promoter for lead frame bonding and application of epoxy composite materials
6个月前
已完结
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