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1710 积分 2024-09-03 加入
Densification mechanism and surface mechanical failure evolution of complex silver nanoparticle interconnection interface via pressure-assisted forced bonding
1小时前
待确认
Cycle thermal simulation of nano silver paste based on Anand model
2个月前
已完结
A Simplified Method for Analyzing PCB Warpage During Reflow: Focusing on Warpage change and Initial Warpage Shape
3个月前
已完结
Technology and Applications of Wide Bandgap Semiconductor Materials: Current State and Future Trends
5个月前
已完结
Modeling and Analysis of SiC GTO Thyristor’s Dynamic Turn-On Transient
5个月前
已完结
Study on warpage of the AlSiC substrate in reflow soldering process of the IGBT module
6个月前
已完结
Modeling the cure shrinkage–induced warpage of epoxy molding compound
6个月前
已完结
Characterization of packaging warpage, residual stress and their effects on the mechanical reliability of IGBT power modules
7个月前
已完结
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