Lv5
1540 积分 2024-09-03 加入
Technology and Applications of Wide Bandgap Semiconductor Materials: Current State and Future Trends
1个月前
已完结
Modeling and Analysis of SiC GTO Thyristor’s Dynamic Turn-On Transient
1个月前
已完结
Study on warpage of the AlSiC substrate in reflow soldering process of the IGBT module
2个月前
已完结
Modeling the cure shrinkage–induced warpage of epoxy molding compound
2个月前
已完结
Characterization of packaging warpage, residual stress and their effects on the mechanical reliability of IGBT power modules
3个月前
已完结
A Micromechanical Analysis to the Viscoplastic Behavior of Sintered Silver Joints under Shear Loading
5个月前
已完结
A novel creep-fatigue life evaluation method for ceramic-composites components
6个月前
已完结
Experimental study and life prediction for aero-engine turbine blade considering creep-fatigue interaction effect
6个月前
已完结
皖公网安备34019202002308
