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2150 积分 2024-09-03 加入
Thermal Shock Life Prediction of the SiC Wide Bandgap Power Module Semiconductor Package Considering Creep Behavior of the Ag Sintered Interconnect and Viscoelastic Properties of the Epoxy Molding Compound
22天前
已完结
Mode I Fatigue and Fracture Assessment of Polyimide–Epoxy and Silicon–Epoxy Interfaces in Chip-Package Components
22天前
已完结
The influence of porosity and pore shape on the thermal conductivity of silver sintered joint for die attach
29天前
已完结
On mode II fracture toughness of sintered silver based on end-notch flexure (ENF) test considering various sintering parameters
29天前
已完结
Prediction of viscoelastic properties of epoxy/graphene oxide nanocomposites: Time-temperature-water ageing superposition
29天前
已完结
Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging
29天前
已完结
Microstructure and Bonding Strength of Low-Temperature Sintered Ag/Nano-Ag Films/Ag Joints
29天前
已完结
Pressure Sintering of Micro-Silver Joints in SiC Power Devices: Optimization of Processing Parameters and FEM Analysis
29天前
已完结
Macroscale and microscale structural mechanisms capable of delaying the fracture of low-temperature and rapid pressureless Ag sintered electronics packaging
29天前
已完结
Stress-induced warpage estimation of advanced semiconductor copper interconnect processes
29天前
已完结
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