Lv6
2580 积分 2024-09-03 加入
Reliability design of power modules: multi time sequence simulation of soldering warpage deformation and fatigue life prediction of solder layers
26天前
已完结
Improved Anand model considering the influence of sintering process on the packaging interconnection of power modules
26天前
已完结
Length effect of short base resin on thermomechanical properties of crosslinked epoxy resin via molecular dynamics simulation
1个月前
已关闭
Thermal conductivities and mechanical properties of epoxy resin as a function of the degree of cross-linking
1个月前
已关闭
Thermal Shock Life Prediction of the SiC Wide Bandgap Power Module Semiconductor Package Considering Creep Behavior of the Ag Sintered Interconnect and Viscoelastic Properties of the Epoxy Molding Compound
2个月前
已完结
Mode I Fatigue and Fracture Assessment of Polyimide–Epoxy and Silicon–Epoxy Interfaces in Chip-Package Components
2个月前
已完结
The influence of porosity and pore shape on the thermal conductivity of silver sintered joint for die attach
2个月前
已完结
On mode II fracture toughness of sintered silver based on end-notch flexure (ENF) test considering various sintering parameters
2个月前
已完结
Prediction of viscoelastic properties of epoxy/graphene oxide nanocomposites: Time-temperature-water ageing superposition
2个月前
已完结
Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging
2个月前
已完结
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