Lv65
2880 积分 2024-09-03 加入
Coupled Thermo-Mechanical-Chemical Simulation Framework for Warpage and Stress Analysis in Post Mold Cure
6天前
已完结
Process-integrated in-situ characterization and multiscale modeling of cure-dependent thermo-mechanical behavior of epoxy molding compounds for accurate warpage prediction in advanced semiconductor packaging
6天前
已完结
Connecting the macroscopic and mesoscopic properties of sintered silver nanoparticles by crystal plasticity finite element method
21天前
已完结
Meso-scale low-cycle fatigue damage of polycrystalline nickel-based alloy by crystal plasticity finite element method
21天前
已完结
Shear failure behavior and interfacial bonding mechanism of fiber/epoxy resin grouting concrete
21天前
已完结
An insight into dynamic properties of SAC305 lead-free solder under high strain rates and high temperatures
21天前
已完结
Geometrical Tolerances: “Planarity” Measurements on Automotive Power Module During Its Assembly Processes-Flow
1个月前
已关闭
Tensile testing, porosity measurements, and material modeling of sintered silver material processed at different sintering pressures and durations
1个月前
已完结
Reliability design of power modules: multi time sequence simulation of soldering warpage deformation and fatigue life prediction of solder layers
2个月前
已完结
Improved Anand model considering the influence of sintering process on the packaging interconnection of power modules
2个月前
已完结
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