| 标题 |
Sequential reflow warpage in SiC hybrid IGBT Modules: Process-Consistent modeling and Mechanism-Based mitigation |
| 网址 | |
| DOI | |
| 其它 |
期刊:Engineering Failure Analysis 作者:Jinlan Wang; Peisheng Liu; Lipeng Tan; Jiajie Jin; Yaohui Deng; et al 出版日期:2026 |
| 求助人 | |
| 下载 |
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(2025-6-4)