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40 积分 2021-09-08 加入
Research on Cu-Sn Interfacial Diffusion Behaviors of Ultrasonic-assisted Bonding by Molecular Dynamics Simulation
26天前
已完结
Size Effect of IMC Growth in Liquid-Solid Reflow Reaction at SAC305/Cu Interface
26天前
已完结
Finite Element Simulation Study of the Effects of Kirkendall Voids in IMC Layer on Interfacial Crack and Reliability of Cu–Sn Solder Joint
26天前
已完结
Fatigue Reliability Analysis of Copper Pillar Bumps Based on Micro-Led
1个月前
已完结
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