Lv11
20 积分 2021-09-08 加入
Research on Cu-Sn Interfacial Diffusion Behaviors of Ultrasonic-assisted Bonding by Molecular Dynamics Simulation
1小时前
待确认
Size Effect of IMC Growth in Liquid-Solid Reflow Reaction at SAC305/Cu Interface
1小时前
求助中
Finite Element Simulation Study of the Effects of Kirkendall Voids in IMC Layer on Interfacial Crack and Reliability of Cu–Sn Solder Joint
2小时前
求助中
Fatigue Reliability Analysis of Copper Pillar Bumps Based on Micro-Led
1个月前
已完结
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