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40 积分 2021-09-08 加入
Machine learning-based co-design of advanced flipchip packages: co-optimization of package warpage, die stress, solder joint reliability, thermal management, and signal integrity
1天前
待确认
Research on Cu-Sn Interfacial Diffusion Behaviors of Ultrasonic-assisted Bonding by Molecular Dynamics Simulation
4个月前
已完结
Size Effect of IMC Growth in Liquid-Solid Reflow Reaction at SAC305/Cu Interface
4个月前
已完结
Finite Element Simulation Study of the Effects of Kirkendall Voids in IMC Layer on Interfacial Crack and Reliability of Cu–Sn Solder Joint
4个月前
已完结
Fatigue Reliability Analysis of Copper Pillar Bumps Based on Micro-Led
5个月前
已完结
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