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780 积分 2022-06-02 加入
Silicon Carbide as a Platform for Power Electronics
19天前
已完结
Status of silicon carbide (SiC) as a wide-bandgap semiconductor for high-temperature applications: A review
19天前
已完结
A review of laser-assisted SiC wafer manufacture: Green and sustainable slicing and planarization for integrated applications
19天前
已完结
Investigation on the Processing Quality of Nanosecond Laser Stealth Dicing for 4H-SiC Wafer
19天前
已完结
Study on picosecond laser stealth dicing of 4H-SiC along [ 11 2 ¯ 0 ] and [ 1 1 ¯ 00 ] crystal orientations on Si-face and C-face
19天前
已完结
Internal Nonthermal Melting of 4H-SiC Induced by Femtosecond Laser Pulses
19天前
已完结
Internal modified structure of silicon carbide prepared by ultrafast laser for wafer slicing
19天前
已完结
Process mechanism of ultrafast laser multi-focal-scribing for ultrafine and efficient stealth dicing of SiC wafers
19天前
已完结
Ultrafast laser processing of materials: a review
19天前
已完结
Femtosecond, picosecond and nanosecond laser ablation of solids
19天前
已完结
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