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140 积分 2022-10-07 加入
CMOS Past, Present and Future
10天前
已完结
Effect of the H2/N2 Ratio on Molybdenum Nitride Thin Films Deposited by Plasma-Enhanced Atomic Layer Deposition: Applications for Next-Generation Interconnects
12天前
已完结
Backside Power Distribution for Nanosheet Technologies Beyond 2nm
19天前
已完结
Efficient Backside Power Delivery for High-Performance Computing Systems
19天前
已完结
Backside Power Distribution for Nanosheet Technologies Beyond 2nm
19天前
已关闭
Demonstration of Logic-Block Performance-Power-Area Gain by 1st Generation Back Side Power Delivery Network for SoC and HPC Applications Beyond 2 nm Node
19天前
已完结
Backside Interconnects for Power Delivery – Design, Manufacturability & Yield
19天前
已完结
Backside Power Delivery: Game Changer and Key Enabler of Advanced Logic Scaling and New STCO Opportunities
19天前
已完结
System Level Analysis and Design Optimization of Back-side Power Delivery Network for Advanced Nodes
19天前
已完结
Nano-Through Silicon Vias (nTSV) for Backside Power Delivery Networks (BSPDN)
19天前
已完结
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