Lv4
420 积分 2026-08-22 加入
Experimental and Simulation Study of Double-Sided Flip-Chip Assembly With a Stiffener Ring
3天前
已完结
Fine pitch BGA device solder bridging mechanism investigation through solder shape modeling
1个月前
已完结
Solder joints design attribute to no solder bridge for fine pitch device
1个月前
已完结
Flux Modification for Wettability and Reliability Improvement in Solder Joints
1个月前
已完结
Influence of flux on wetting behavior of lead-free solder balls during the infrared-reflow process
1个月前
已完结
Influence and mechanism of ultrafast laser-textured Cu substrate on wetting behavior of SAC305 solder
2个月前
已完结
Oxidation of Lead Frame Copper Alloys with Different Compositions and Its Effect on Oxide Film Adhesion
2个月前
已完结
Flux Modification for Wettability and Reliability Improvement in Solder Joints
2个月前
已完结
Wettability in lead-free soldering: Effect of plasma treatment in dependence on flux type
2个月前
已完结
Current status on optimizing solder wettability from substrate surface treatment, alloying solder, flux, and process environments
2个月前
已完结
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