Lv5
990 积分 2025-11-17 加入
Interfacial fracture toughness of sintered hybrid silver interconnects
24天前
已完结
Effect of underfill filler settling on thermo-mechanical fatigue analysis of flip-chip eutectic solders
30天前
已完结
Towards model-based engineering of underfill materials: CTE modeling
30天前
已完结
Prediction of thermal expansion coefficient of fiber-reinforced cement concrete based on micromechanics method
30天前
已完结
Effective elastic modulus of underfill material for flip-chip applications
30天前
已关闭
A Survey of Projection-Based Model Reduction Methods for Parametric Dynamical Systems
30天前
已完结
Low Thermal Resistance (0.5 K/W) Ga₂O₃ Schottky Rectifiers With Double-Side Packaging
30天前
已完结
High-performance and high-reliability Ga2O3 Schottky barrier diodes enabled by double-side packaging integrated with microchannel cooling
30天前
已完结
Handling tensors using tensorial Kelvin bases: application to olivine polycrystal deformation modeling using elastically anistropic CPFEM
2个月前
已完结
Damage and viscoplastic behavior of sintered nano-silver joints under shear loading
3个月前
已完结
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