Lv11
90 积分 2025-08-07 加入
Performance evaluation and mechanism analysis of a novel cleaning solution for particle and organic contamination on copper surface
2天前
已完结
Surface Analysis and Material Characterization Techniques Used in Semiconductor Industry to Identify and Prevent Failures
3天前
求助中
Application of an optimized alkaline cleaning solution for inhibitor removal during the post-CMP process: Performance evaluation and mechanism analysis
16天前
已完结
Synergistic Effect of Composite Complex Agent on BTA Removal in Post-Cu-CMP: Experimental and Theoretical Analysis
16天前
已完结
Enhancement of Electromigration Reliability of Electroless-Plated Nanoscaled Copper Interconnects by Complete Encapsulation of a 1 nm-Thin Self-Assembled Monolayer
17天前
已完结
The encaging of cobalt interconnect lines with an ordered amino-based self-assembled monolayer for electromigration mitigation using an all-wet electroless process
17天前
已完结
Characterizing Self-Assembled Monolayer Breakdown in Area-Selective Atomic Layer Deposition
22天前
已完结
Next generation nanopatterning using small molecule inhibitors for area-selective atomic layer deposition
22天前
已完结
Rapid Octadecylphosphonic Acid Self-Assembled Monolayer Formation on Cu for Etch Inhibition: Characterizations Using Sum Frequency Generation Vibrational Spectroscopy
23天前
已完结
A Mechanistic Analysis of Oxidation-Induced Defects During Tungsten CMP: Interactions of Process, Material, and Environmental Factors
23天前
已完结
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